Global Sales Team

Brief: Ormet Sales Representatives are trained to bring you the understanding of the TLPS Technology and it`s associated applications. They connect you to our technical and business teams to develop affordable, high quality solutions for you and your customer. Please contact your local representative by Region and Application.

contact: Venky Sundaram
Research Director
,
404-894-9394
vs24@gatech.edu

Americas

Insulectro/Integral Technology
contact: Ken Parent
President
20362 Windrow Drive
Lake Forest CA, US 92630
9495873396
kparent@insulectro.com

Handles: Z Interconnect and Thermal Fill for PWB. Americas and Europe


Asia

CMT Portfolio Management
contact: Yong Hoon Choi
Sales
2F, KGC B/D, 1340-14, Seocho-2Dong, Seocho-Gu
Seoul Korea, KR 137-861
82-2-597-6207
yhchoi@cmtcorp.co.kr
Hypersonic, Inc.
contact: Jacob Chang
Vice President
No. 209, Sec. 2, Junghua Rd.
Taoyuan , TW 32068
886-3-4611902
Jacob_Chang@hpc.com.tw

Handles: Semi conductor die attach materials. Region: Taiwan, China, Thailand

CMT Portfolio Management
contact: John Shin
Sales Manager
2F, KGC B/D, 1340-14, Seocho-2Dong, Seocho-Gu
Seoul Korea, KR 137-861
+82-2-597-6207
john_shin@cmtcorp.co.kr

Handles: Z Interconnect & Thermal fill for PWB structures. Region: South Korea

Ormet Circuits Inc.
contact: yosuke sagami
7-119,5 Chome
Kawasaki-shi Chiyogao Ka, Asoa-ku, jp 215-0005
011818014487296
ysagami@ac.auone-net.jp

Handles: Z Interconnect & Thermal fill for PWB structures. Region: Japan

AGEC Singapore
contact: Mason Law
71 TCH Techcentre, Toh Guan East
Singapore Singapore, 65 608598
011-65-6567-8018
masonlaw@aglobe.com.sg

Handles: Z Interconnect & Thermal fill for PWB structures. Region: Taiwan, China, Thailand, Malaysia Singapore


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