"Goings On"

Brief:

Announcement

Date: 2015-12-14 San Diego, CA (Ormet Circuits)

Ormet Joins Merck Through Acquisition

Merck KGaA, Darmstadt, Germany, Acquires Ormet Circuits

• Acquisition to enhance position as semiconductor materials supplier

• Deal complements existing Integrated Circuit Materials

business unit

Darmstadt, Germany, December 14, 2015 Merck KGaA, Darmstadt, Germany, a leading science and technology company, today announced that it has acquired Ormet Circuits Inc., to strengthen its position as a materials supplier for the semiconductor industry.

Ormet is an early-stage, venture-capital-backed business located in San Diego, California. It has previously been owned by various institutional and private investors, of which PEI Funds, a US-based investment company, was the single largest shareholder. Merck KGaA, Darmstadt, Germany, has already held a minority stake in Ormet and has now taken over all remaining shares. The parties have agreed not to disclose the purchase price.

Ormet has developed conductive pastes based on a unique environmental friendly technology which can solve technical challenges in semiconductor packaging. This is particularly interesting due to the growing demand for highly integrated devices such as mobile phones or wearables, said Rico Wiedenbruch, Head of the Integrated Circuit Materials business unit. Semiconductor packaging is the final stage of semiconductor device fabrication in which the device is assembled and encased.

Ormets pastes utilize a novel, patented sintering technology. This technology makes it possible to replace lead-based solders used in semiconductor applications, as well as enhance the reliability of devices when they are operating at elevated temperatures.

The companys Integrated Circuit Materials business unit, part of the Groups Performance Materials business sector, already has a strong position as a semiconductor materials supplier. Ormets technology will now allow Merck KGaA, Darmstadt, Germany, to further strengthen this position and will diversify the product portfolio.

Merck KGaA, Darmstadt, Germany, is counting on innovative technologies to tap into additional growth areas in the electronics industry to benefit even more from the increasing demand for electronic devices beyond displays. By combining various competencies, the company will be in an even stronger position in the future to serve the demand for materials with increasingly complex functionalities.

About Ormet

Headquartered in San Diego, CA, Ormet Circuits, Inc. is a clean tech materials company that manufactures conductive pastes for the semiconductor, assembly and printed circuit board industries. Ormet materials comply with RoHS, and the company adheres to a strict conflict minerals policy while practicing sustainable methods in their manufacture. Supplementary information can be found at http://ormetcircuits.com.

All Merck KGaA, Darmstadt, Germany, press releases are distributed by e-mail at the same time they become available on the EMD Group Website. In case you are a resident of the USA or Canada please go to www.emdgroup.com/subscribe to register again for your online subscription of this service as our newly introduced geo-targeting requires new links in the email. You may later change your selection or discontinue this service.

Merck KGaA, Darmstadt, Germany, is a leading science and technology company in healthcare, life science and performance materials. Around 50,000 employees work to further develop technologies that improve and enhance life from biopharmaceutical therapies to treat cancer or multiple sclerosis, cutting-edge systems for scientific research and production, to liquid crystals for smartphones and LCD televisions. In 2014, Merck KGaA, Darmstadt, Germany, generated sales of euro 11.3 billion in 66 countries.

Founded in 1668, Merck KGaA, Darmstadt, Germany, is the world`s oldest pharmaceutical and chemical company. The founding family remains the majority owner of the publicly listed corporate group. Merck KGaA, Darmstadt, Germany, holds the global rights to the Merck KGaA, Darmstadt, Germany, name and brand. The only exceptions are the United States and Canada, where the company operates as EMD Serono, MilliporeSigma and EMD Performance

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For more information about Ormet Circuits, Inc. please visit www.ormetcircuits.com or email support@ormetcircuits.net

Press Release

Date: 2015-10-16 San Diego, CA (Ormet Circuits)

KEMET Releases High Temperature Soldering Study

Greenville, South Carolina (October 16, 2015) KEMET Corporation (NYSE: KEM), a leading global supplier of electronic components, released its study supporting transient liquid phase sintering (TLPS) materials as an alternative for high temperature lead-based solders.

KEMET Electronics and Ormet Circuits, Inc. completed a multi-year study focused on the characterization of high temperature multilayer ceramic capacitors using TLPS materials. The objective was to develop a ceramic capacitor component that was both RoHS compliant and had robust reliability in harsh, high temperature operating environments.

"KEMET customers want robust products that can thrive in todays high operating temperatures,"said Dr. John Bultitude, KEMET Vice President and Technical Fellow."Ormet was a natural choice for this study because its TLPS materials are uniquely positioned as a green technology with enabling electrical properties."

The results of the study were presented in a keynote address at the Material and Science Technology Conference held in Columbus, Ohio earlier this month. The presentation can be downloaded on KEMETs Engineering Center. The full publication may also be purchased through Springerlink for a small fee.

About KEMET

KEMET Corporation is a leading global supplier of electronic components. We offer our customers the broadest selection of capacitor technologies in the industry, along with an expanding range of electromechanical devices, electromagnetic compatibility solutions and supercapacitors. Our vision is to be the preferred supplier of electronic component solutions demanding the highest standards of quality, delivery and service. KEMETs common stock is listed on the NYSE under the symbol KEM. Additional information about KEMET can be found at http://www.kemet.com.

About Ormet

Headquartered in San Diego, CA, Ormet Circuits, Inc. is a clean tech materials company that manufactures conductive pastes for the semiconductor, assembly and printed circuit board industries. Ormets materials comply with RoHS, and the company adheres to a strict conflict minerals policy while practicing sustainable methods in their manufacture. Supplementary information can be found at http://ormetcircuits.com.

Cautionary Statement on Forward-Looking Statements

Certain statements included herein contain forward-looking statements within the meaning of federal securities laws about KEMET Corporations (the"Company") financial condition and results of operations that are based on management`s current expectations, estimates and projections about the markets in which the Company operates, as well as management`s beliefs and assumptions. Words such as"expects,""anticipates,""believes,""estimates,"variations of such words and other similar expressions are intended to identify such forward-looking statements. These statements are not guarantees of future performance and involve certain risks, uncertainties and assumptions, which are difficult to predict. Therefore, actual outcomes and results may differ materially from what is expressed or forecasted in, or implied by, such forward-looking statements. Readers are cautioned not to place undue reliance on these forward-looking statements, which reflect management`s judgment only as of the date hereof. The Company undertakes no obligation to update publicly any of these forward-looking statements to reflect new information, future events or otherwise.

Certain risks and uncertainties that could cause actual outcome and results to differ materially from those expressed in, or implied by, these forward-looking statements are described in the Companys reports and filings with the Securities and Exchange Commission.

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For more information about Ormet Circuits, Inc. please visit www.ormetcircuits.com or email support@ormetcircuits.net

Announcement

Date: 2015-02-07 San Diego, CA (Ormet Circuits)

Ormet welcomes Mr. Vyomesh Joshi

Ormet Circuits welcomes Mr. Vyomesh Joshi to the Board of Directors. Mr. Joshi brings over 30 years of technical and executive management experience to Ormet. He retired in 2012 as Executive Vice President, Imaging and Printing Group of Hewlett-Packard Company ("HP). The board and management of Ormet are looking forward to working with him as he brings his extensive experience to help grow the company.

Mr. Joshis many achievements are described more fully in the Board of Director section of this website.

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For more information about Ormet Circuits, Inc. please visit www.ormetcircuits.com or email support@ormetcircuits.net

Announcement

Date: 2014-07-23 San Diego, CA (Ormet Circuits)

Ormet welcomes Tom Borghard

Mr. Tom Borghard has joined Ormet Circuits, Inc. as Semiconductor Materials Business Manager. Tom will be essential to helping launch and commercialize the new semiconductor die attach paste product line.

Tom has approximately 20 years experience in the electronic materials industry, where he has worked for Ciba Specialty Chemicals, Ablestik, and Nagase. He has a broad background including, Marketing, Product Management, and Sales. During his career he successfully launched newly developed soldermask, die attach, and underfill products through R&D development, customer qualification, and commercialization. Tom earned a Bachelors in Biology from Hobart College and a MBA from Pace University.

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For more information about Ormet Circuits, Inc. please visit www.ormetcircuits.com or email support@ormetcircuits.net

Press Release

Date: 2014-04-08 San Diego, CA (Ormet Circuits)

AZ Electronic Materials Signs Distribution Agreement with Ormet Circuits Inc. for Conductive Pastes

"AZ Electronic Materials ("AZ"), a leading global producer of high quality, high-purity specialty chemical materials used in the manufacturing of semiconductors, flat panel displays and LEDs, announced today that it has entered into a distribution agreement with Ormet Circuits, Incorporated ("Ormet"), a leader in the design, manufacture, and sale of sintering, electrically conductive materials, for use in the manufacture of advanced electronic devices. Ormet`s conductive sintered-metal pastes offer improved electrical performance with greater processing flexibility than conventional lead-based solders and conductive adhesives.

Based in San Diego, California, Ormet develops lead-free conductive pastes which are based on the company`s proprietary and patent protected Transient Liquid Phase Sintering (TLPS) technology. Ormet`s products are used in a variety of applications -- from circuit board fabrication to semiconductor packaging.

AZ`s global sales and technical support infrastructure and vast experience working within a certified electronics supply chain will enhance Ormet`s abilities to place their innovative materials with leading semiconductor manufacturing companies.

Geoff Wild, AZ`s Chief Executive Officer, commented: "Collaborating with the Ormet team provides AZ with the opportunity to apply our global footprint and industry- leading material scale-up capabilities to the development of semiconductor packaging materials. Ormet`s proprietary technologies, combined with AZ`s global presence, will support semiconductor companies worldwide."

"We are pleased to join with AZ in developing a solution that is essential for the semiconductor packaging industry in producing advanced and environmentally friendly semiconductors," said Michael Matthews, Ormet`s Chief Executive Officer, adding: "Our lead-free electrically conductive materials offer many advantages over conventional solders, in the semiconductor packaging and advanced circuit board industries. We are looking forward to collaborating with AZ in broadening the availability of our advanced semiconductor packaging materials in the market."

As part of the collaboration between the two companies, AZ is also making a strategic equity investment in Ormet. The strategic advisory firm of Cerian Technology Ventures, LLC has advised Ormet on the transaction.

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For more information about Ormet Circuits, Inc. please visit www.ormetcircuits.com or email support@ormetcircuits.net

Announcement

Date: 2014-01-24 San Diego, CA (Ormet Circuits)

Ormet Circuits to Display Zeta Lock in Conjunction with Insulectro Technologies

Ormet Circuits in conjunction with Insulectro Technologies will display at booth 723 during Design Con 2014. Insulectro will demonstrate the capability of sintered paste interconnects with its exclusive Zeta Lock material set. DesignCon is the premier technical conference dedicated to the pervasive nature of signal integrity at all levels of electronic design: chip, package, board & system. Featuring 100+ conference sessions across 14 tracks, DesignCon covers the latest in: • Signal & Power Integrity • PCB Design Tools & Methodologies • Analog & Mixed-Signal Design • Parallel & Memory Interface Design • Jitter, Crosstalk and more! Visit and learn the benefits of pasting over plating your circuit interconnect. Exhibit dates are January 29th and 30th located in the Santa Clara Convention Center, Santa Clara California.

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For more information about Ormet Circuits, Inc. please visit www.ormetcircuits.com or email support@ormetcircuits.net

Announcement

Date: 2013-08-05 San Diego, CA (Ormet Circuits)

IPC Conference on Component Technology: Closing the Gap in the Chip to PCB Process

Abstract:

The electronic packaging industry is undergoing an evolutionary convergence between the printed circuit board segment and the semiconductor packaging segment. New, streamlined and hybrid package architectures are emerging to meet future product requirements particularly for mobile electronics. In these new package configurations there are significant challenges in moving heat away from the working devices without adding weight or volume. Thermal transfer must be very efficient without adding the significant manufacturing costs of solutions such as plated closed thermal drains. It is critical that interfaces not form heat barriers that are significantly different in thermal transfer than the bulk of the thermal drain material. Similarly, there are new challenges for forming electrical interconnections between different types of package elements while maintaining high volume manufacturability and reliability. Anywhere placement of vias becomes particularly critical in mixed mode and very high-interconnect-density packaging. In these complex architectures, high performance of every material and efficient use of every bit of real estate is at a premium. Using copper plating to address these issues can result in high manufacturing costs and process complexity and conductive pastes lack the performance and reliability. Sintering pastes, which metallurgically bond to circuit pads, offer both high performance and versatility of installation that is conducive to high manufacturing volumes. Because sintering pastes can be formulated with a variety of particle sizes and flow behavior this technology can provide a spectrum solution to applications from filled microvias in either a printed circuit board or semiconductor package scale, to printed bumps for interconnection of subassemblies, to thermal drain fill. This paper will present the current implementation of sintering pastes in z-axis thermal and electrical transfer as well as the roadmap for future sintering paste formulations to address additional z-axis interconnection requirements.

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For more information about Ormet Circuits, Inc. please visit www.ormetcircuits.com or email support@ormetcircuits.net

Announcement

Date: 2013-05-28 San Diego, CA (Ormet Circuits)

ECTC Las Vegas May 29-31

Ormet and NSCC welcome you to visit their display at The Cosmopolitan Hotel in Las Vegas introducing new products for semiconductor interconnect markets.

Ormet Circuits, Incorporated (Ormet) is a privately held company, engaged in the design, manufacture, and sale of conductive pastes for use in the manufacture of advanced electronic devices. Ormet pastes are lead-free, highly electrically and thermally conductive and provide good intermetallic joints at relatively low temperatures.

Nippon Steel & Sumikin Metal Products Co., Ltd., as a core member of the Nippon Steel & Sumitomo Metal Corp.Group, enables higher performance in electronic devices such as mobile, PC, and LCD TV through innovations in chemical technologies which have become indispensible for living in modern society.

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For more information about Ormet Circuits, Inc. please visit www.ormetcircuits.com or email support@ormetcircuits.net

Announcement

Date: 2013-04-06 San Diego, CA (Ormet Circuits)

Ormet to Present during the IPC designer Council Meeting in Austin Texas

Creating `Any Layer` Via Interconnects with Sintering Pastes in Multilayer Structures Learn how Paste microvias are a cost-effective and reliable alternative Presented by: Jim Haley VP of Sales at Ormet Circuits, Inc. - San Diego, CA

Today`s high density structures force fabricators into multiple lamination cycles and complex copper plating schemes to construct sophisticated products. Jim Haley will present the use of sintering paste vias enabling Z-axis interconnections where plated-through holes are no longer useful due to density and layer count demands.

April Chapter meeting

April 9, 2013 6 P.M.

Cadence Design Systems, Inc.

12515 7 Research Boulevard, Ste 250

Austin Texas 78759

Two different implementations will be presented to showcase the range of design freedom enabled by this technology. Sintered paste alleviates today`s design limitations allowing a new generation of interconnect options. Reliable, high yield and cost effective designs are now available

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For more information about Ormet Circuits, Inc. please visit www.ormetcircuits.com or email support@ormetcircuits.net

Announcement

Date: 2013-02-05 San Diego, CA (Ormet Circuits)

IPC Apex 2013

Visit Ormet as they present in the Technical Conference Sessions with Integral Technology.

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For more information about Ormet Circuits, Inc. please visit www.ormetcircuits.com or email support@ormetcircuits.net

Announcement

Date: 2012-09-10 San Diego, CA (Ormet Circuits)

Lead-Free Die Attach Solutions for High Power Applications

San Diego, CA — August 29, 2012 — Ormet Circuits, Inc. (Ormet) - Jim Haley, VP of Sales and Marketing delivered a presentation about the unique advantages of sintering materials for lead-free die attach applications at IPC Midwest, Schaumburg, IL on August 22, 2012.

Jim`s presentation, Lead-Free Die Attach Technology for High Power Applications, began with a brief introduction to the problems associated with lead in today`s marketplace. The relative merits of available "lead-free" die attach materials (e.g. lead-free solders, silver sintering, conductive adhesives, and transient liquid phase sintering) were contrasted with an emphasis on particularly demanding applications such as power modules, MosFETs and IGBTs.

Jim also presented Ormet Circuits` transient liquid phase sintering (TLPS) materials in further detail. He explained that these materials exhibit characteristics particularly well suited to high power lead free die attach applications. Performance data was also presented. For a copy of the presentation please visit www.ormetcircuits.com.

Since joining Ormet in 2003, Jim has been responsible for all sales and marketing activities of the company. Jim holds a Bachelor of Business Administration degree. He is an IMAPS Member, IPC Member / Steering Committee, New Technology Subcommittee.

IPC is a global trade association dedicated to the competitive excellence and financial success of its member companies. IPC members represent all facets of the electronics interconnect industry. IPC is a leading source for industry standards, training, market research, and public policy advocacy.

Ormet is a leader in the design, manufacture, and sale of sintering, electrically conductive materials for use in the manufacture of advanced electronic devices. Applications include semiconductor die attach, component attach, via fill, z-axis interconnection, conductive lines and traces and plated-through hole fill. Founded in 2001, Ormet has distribution and representative organizations throughout the world.

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For more information about Ormet Circuits, Inc. please visit www.ormetcircuits.com or email support@ormetcircuits.net

Announcement

Date: 2012-08-30 San Diego, CA (Ormet Circuits)

Semicon Taiwan

Location: Booth #690 Taiwan World Trade Center, Nangang Hall

Taipei, Taiwan

Date: September 5, 2012 - September 7, 2012

Semicon Taiwan 2012 — The largest Microelectronics industry event is coming soon! The conference hosts more than 1,200 key players in the Semiconductor, FPD, MEMS, Display and Microelectronics industries.

Ormet Circuits will be exhibiting in the Hypersonic, Inc. booth #690 in the Nangang Hall of the convention center. Please stop by the booth to learn more about our product applications which include semiconductor die attach, via fill, z-axis interconnection, and other interconnect applications.

Hypersonic, Inc. ( http://www.hpc.com.tw/ ) is the Ormet Circuits agent for semiconductor die attach materials in Taiwan and China.

We hope to see you in Taiwan in September!

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For more information about Ormet Circuits, Inc. please visit www.ormetcircuits.com or email support@ormetcircuits.net

Press Release

Date: 2012-07-03 San Diego, CA (Ormet Circuits)

ORMET CIRCUITS AND INTEGRAL TECHNOLOGY INK DEAL TO BRING BREAKTHROUGH PRODUCTS TO PCB INDUSTRY

Ormet Circuits (www.ormetcircuits.com), a manufacturer of electrically conductive pastes for the PCB and semiconductor industries has announced it has signed a 5-year sales and distribution agreement with Integral Technology, Inc. (www.integral-hdi.com), a manufacturer and distributor of HDI electronic materials for the printed circuit board industry.

Ormet President Michael Matthews stated, "Ormet sintering materials technology enables a next generation of high density, high performance PCBs by eliminating the need for back-drilling and high-aspect-ratio plated through holes.

"Ormet Circuits is pleased to work with Integral to take the business to the next level. Ormet is looking forward to working with Integral at the OEM`s and ODM`s as well as at the PCB fabricators in order to increase our position in markets requiring advanced PCB designs," Matthews concluded.

Integral CEO Tim Redfern agrees, "This is an important development as Integral continues to grow our position in creating the next generation HDI printed circuit boards. We are excited to develop Ormet` s business and to bring this exciting new material to the printed circuit board market using our technology and established channels to market.

"Ormet` s processing offers a strong value proposition in regards to reliability, time to market, capital equipment savings and environmental improvements used to make next generation PCB`s." Redfern added.

Integral President Ken Parent added, "Integral Technology brings together manufacturers of PCB technology with technically capable channels to market to those who require advanced materials. By bringing such a unique product to market, you really start to see the future of electronics begin to reveal itself."

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For more information about Ormet Circuits, Inc. please visit www.ormetcircuits.com or email support@ormetcircuits.net

Announcement

Date: 2012-02-02 San Diego, CA (Ormet Circuits)

APEX 2012

Please join Ormet Circuits, Inc. in the upper level Sails Pavilion in booth #711, as they participate in IPC`s APEX EXPO 2012. The IPC Expo is the industry`s only event dedicated to the entire supply chain of electronic interconnections for printed wiring boards, design, manufacturing, assembly and test.

Headquartered in San Diego, CA, Ormet Circuits, Inc. was incorporated in 2003 to manufacture and market conductive pastes and inks for the printed circuit board fabrication and microelectronics industries. Ormet conductive materials find wide use in many electronic applications from radar antennas to semiconductor packages, complex circuit boards, and electronic components and assemblies.

For more information about Ormet Circuits, Inc. please visit www.ormetcircuits.com or email support@ormetcircuits.net.

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For more information about Ormet Circuits, Inc. please visit www.ormetcircuits.com or email support@ormetcircuits.net

Press Release

Date: 2010-10-05 San Diego, CA (Business Wire)

Ormet Circuits received ISO 9001:2008 Quality Management certification

Ormet Circuits, Inc. today announced that it has received ISO 9001:2008 Quality Management certification for the design, development, and manufacture of conductive pastes, inks and other materials for electronic applications and components.

The certification verifies that key processes used to deliver its pastes are continually monitored and improved to support quality of materials and service to its customer base. The certification applies to all organizational functions and departments and is broadly endorsed by senior management.

The ISO 9001:2008 standard is a set of quality practices that ensures the use of effective processes that are consistently monitored and continually improved. As the industry standard for quality management systems, ISO 9001:2008 certification requires evaluation by an independent, accredited auditing body.

The certification process required Ormet to implement an ISO-compliant quality management system that established a systematic approach to manufacturing and managing the production processes. IQNet and Nemko acted as the third-party auditor, assessed processes for effectiveness as well as the team`s compliance with the established processes. The one year assessment focused on research and development, product manufacturing, network event management, user request management, packaging, reliability, documentation and records management, problem prevention and correction with other quality management practices within Ormet`s organization.

"Our focus on continued process improvement fosters customer confidence along with increased consistency and efficiency," said James Haley senior vice president of Marketing and Sales. "Obtaining ISO certification demonstrates Ormet`s commitment to deliver a high level product to its electronic fabrication customer base."

Headquartered in San Diego, CA, Ormet Circuits, Inc. was incorporated in 2003 to manufacture and market conductive pastes and inks for the printed circuit board fabrication and microelectronics industries. Ormet conductive materials find wide use in many electronic applications from radar antennas to semiconductor packages, complex circuit boards, and electronic components and assemblies.

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For more information about Ormet Circuits, Inc. please visit www.ormetcircuits.com or email support@ormetcircuits.net

Press Release

Date: 2010-05-22 San Diego, CA (Business Wire)

Ormet Circuits, Inc. announces a high-melting Pb-free solder alternatives agreement with the Indium

Ormet Circuits, Inc. announced the signing of a joint marketing and technical support agreement with Indium Corporation for its patented transient liquid phase sintering assembly materials.

The agreement enables Indium Corporation to offer a line of high-temperature, Pb-free (lead-free) assembly materials that addresses the requirements of many power semiconductor and semiconductor packaging applications. When Pb-free is a requirement, the only suitable high-temperature solder that exists is the AuSn eutectic alloy. These transient liquid phase sintering (TLPS) materials, which offer an alternative technology to solder, provide many of the assembly process advantages of a low-melting Pb-free solder combined with high temperature joint stability.

Indium Corporation Global Product Manager Dr. Andy Mackie said, "Ormet is leveraging Indium Corporations global sales and technical support capabilities to offer these products into the electronics assembly, passive component assembly, and semiconductor assembly markets. The Indium Corporation is leveraging Ormet`s unique materials set. This combination ultimately benefits our customers and the marketplace."

"Ormet is gaining a valuable sales channel partner to introduce and deliver the next generation of assembly and interconnect materials to the electronics assembly industry," said James Haley Ormet`s Vice President of Marketing and sales.

Headquartered in San Diego, CA, Ormet Circuits, Inc. was incorporated in 2003 to manufacture and market conductive pastes and inks for the printed circuit board fabrication and microelectronics industries. Ormet conductive materials find wide use in many electronic applications from radar antennas to semiconductor packages, complex circuit boards, and electronic components and assemblies.

Indium Corporation is a premiere materials supplier to the global electronics, semiconductor, solar, thin film and thermal management markets. Products include solders, performs, and fluxes; brazes; sputter targets; indium, gallium, and germanium chemicals and sourcing; and Reactive NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Singapore, South Korea, the United Kingdom, and the USA.

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For more information about Ormet Circuits, Inc. please visit www.ormetcircuits.com or email support@ormetcircuits.net

Press Release

Date: 2010-03-01 San Diego, CA (Business Wire)

Ormet Circuits Inc. has released its next RoHS compliant Z-Interconnect paste

Ormet Circuits Inc. has released its next RoHS compliant Z-Interconnect paste for use in multilayer printed wiring board structures. Ormet`s Z interconnect pastes are used in Military, Telecommunications and network server boards, Personal Digital Assistants, RF assemblies and smart phones.

Ormet 701 material provides designers and fabricators a powerful material and process solution enabling current PWB manufacturing processes to meet Original Equipment Manufacturers (OEM) high-density designs with higher yield and reliability. The manufacturing improvements permitted by Ormet`s materials promote limited lamination cyclesshortened production time, andreduced overall PWB costs. The Ormet paste extends the fabricators` toolbox for placing micro-vias in any layer at any location within the PWB.

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Ormet 701 is a transient liquid-phase sintered (TLPS) paste that is a composite metal and polymerbased material that undergoes dynamic structural changes during low-temperature heat treatment. During processing, a continuous metal network is created between the paste`s metal particles and the adjoining metal layers in the multilayer substrate. The resulting metal network is highly electrically and thermally conductive and exhibits stable properties above 265°C.

"PWB Fabricators are asking for tools and materials that save on processing time, reduces cost, and yet offers the same reliability of their current structures," says James Haley, Company Vice President, for Ormet Circuits Inc. "This new release makes it possible for fabricators to increase capacity without adding additional capital equipment. It also gives designers greater freedom over the current standards, while still meeting essential reliability data curves that are accepted by the industry."

Ormet Circuits, Inc. was incorporated in 2003 to manufacture and market conductive pastes and inks for the printed circuit board fabrication and microelectronics industries. The company occupies an 18,000 square foot facility in San Diego that had previously been Honeywell Incorporated`s Advanced Polymer Operation. The building has explosion-proof laboratories, Class 1000-10,000 clean rooms and extensive production and analytical equipment.

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For more information about Ormet Circuits, Inc. please visit www.ormetcircuits.com or email support@ormetcircuits.net

Press Release

Date: 2009-10-15 San Diego, CA (Business Wire)

Breakthrough Sintering Conductive Paste for Fine Feature Electrical Interconnects

San Diego, CA -- October 19, 2009 -- Ormet Circuits today announced the availability in production quantities of a new conductive paste for fine line dispensing applications. Designated Ormet 260C, this unique Lead-free material exhibits a patented `Transient Liquid Phase Sintering` reaction that enables low temperature curing and robust electrical and mechanical stability. Compared to silver filled epoxy materials, Ormet 260C is significantly more electrically stable after temperature cycling and exposure to Pb-free solder reflow temperatures. Ormet 260C has been formulated with a patent-pending metal filler package specifically designed for the ability to be dispensed in line widths down to 80-100microns.

After Ormet 260C is jet dispensed in a pattern, where the lines are 100 microns wide, and the serpentine is created at a 200 micron pitch, the material is cured either in a belt reflow oven or in a box oven. The rheology of Ormet 260C is tailored to prevent spreading, or slumping, of the material while wet or during the cure process. Long term dispensing experiments using an Asymtek DJ9000 jet dispenser have verified a high process capability, showing robust 100 micron line width, 150 micron pitch capability, and 12 hours working time.

Ormet`s unique sintering technology enables Ormet 260C to be cured as low at 165C in a box oven, or IR reflow oven. When cured, Ormet 260C bonds well to both metal and polymer surfaces, and has been qualified to interconnect and enhance the electrical performance of electronics devices. A feature of Ormet 260C is that it will metallurgically bond to solderable surfaces, and adhesively bond to polymer surfaces. This attribute provides enhanced electrical resistivity versus conductive adhesives, and a broader range of bonding applications than solders. Additionally, after Ormet 260C is cured, the material retains a solderable surface for a subsequent assembly process. Overall, Ormet 260C is a robust solution for creating fine lines and traces, and is an ideal paste for a range of applications in the solar and microelectronic markets.

"Ormet 260C is truly a breakthrough product in that it enables alternate techniques for forming electrical interconnections within a range of microelectronic and solar applications. The low sintering temperatures used to cure 260C enable the use of traditional solder or adhesive cure equipment, and will enable customers to design new semiconductor assembly processes where components are interconnected in a 3-D space using dispensing technology," stated Ken Holcomb, VP of Engineering at Ormet Circuits. "At a time when the competitive marketplace demands new products at reduced cost and minimum capital investment, I believe we have a unique product in Ormet 260C compared to traditional conductive adhesives and low melting solders," he added.

Ormet Circuits, Inc. was incorporated in 2003 to manufacture and market conductive pastes and inks for the printed circuit board fabrication and microelectronics industries. The company occupies a 18,000 square foot facility in San Diego that had previously been Honeywell Incorporated`s Advanced Polymer Operation. The building has explosion-proof laboratories, Class 1000-10,000 clean rooms and extensive production and analytical equipment.

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For more information about Ormet Circuits, Inc. please visit www.ormetcircuits.com or email support@ormetcircuits.net

Press Release

Date: 2009-09-30 San Diego, CA (Business Wire)

Ormet Circuits, Inc today announced Hypersonic Inc. as its sales representative for Taiwan and China

Ormet Circuits, Inc today announced Hypersonic Inc. as its sales representative for Taiwan and China for the semiconductor packaging materials market. Managed by Tony Chen, Hypersonic has a broadly capable technical sales staff with expertise in electronic materials and equipment. Strategically located in Jung Li, Taiwan and Shanghai, China, Hypersonic intends to supply a complete line of electronic materials to semiconductor packaging companies thereby enabling them to commercialize advanced semiconductor packaging designs.

Ormet Circuits offers a range of conductive pastes and inks for printed circuit board fabrication and IC packaging applications, featuring high electrical and thermal conductivity, Pb-free reflow compatibility, and RoHS and Halogen free compliance capabilities. In addition, a number of materials are available as an alternative to Gold wirebonds and for high power LED die attach applications.

"We are proud to join forces with Tony Chen and the Hypersonic team," remarked James Haley, VP of Sales for Ormet Circuits. "The reputation and expertise of the Hypersonic organization is well known in the industry. We are truly excited about the opportunities available to us through their extensive contacts and years of experience in the Taiwan and China semiconductor markets. Overall, Ormet`s sales coverage in Asia now includes both Hypersonic and Globe Electronic Corporation, who handles the PCB Fabrication market for Ormet Circuits."

Ormet Circuits was incorporated in 2003 to commercialize, manufacture and market conductive pastes and inks based on its patented `Transient Liquid Phase Sintering technology. Products are currently in commercial use in the Microelectronics and Printed Circuit Board fabrication industries. The company occupies a 18,000 square foot facility in San Diego that has Class 1,000-100,000 clean rooms and production areas, and extensive production and analytical equipment for volume manufacturing of its conductive compounds.

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For more information about Ormet Circuits, Inc. please visit www.ormetcircuits.com or email support@ormetcircuits.net

Announcement

Date: 2008-07-31 San Diego, CA (Ormet Circuits)

Mr. Michael Matthews has joined the Ormet Circuits team as President

I am pleased to announce that Mr. Michael Matthews has joined the Ormet Circuits team as President. In this role Mike will lead the development, sales and manufacturing activities of the company. His goal is to grow the company into a major supplier of conductive pastes using Ormets unique, proprietary Transient Liquid Phase technology.

Mr. Matthews was most recently Business Manager of Global Business Development at Ablestik Laboratories. During his 13 year career at Ablestik Laboratories, Mr. Matthews held positions in the Technical Service, Sales, and Marketing functions as well as serving on Ablestik`s Global Leadership Team. Michael also served in key roles managing Ablestik`s global die attach and flip chip assembly material product lines. Mr. Matthews holds a B.S. Materials Engineering from Rensselaer Polytechnic Institute and a MBA from Pepperdine University.

Patrick Rivelli, Chairman

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For more information about Ormet Circuits, Inc. please visit www.ormetcircuits.com or email support@ormetcircuits.net

Announcement

Date: 2008-07-31 San Diego, CA (Ormet Circuits)

Technical Paper Sessions are in full swing and the latest presentation from Ormet Circuits, Inc.

Technical Paper Sessions are in full swing and the latest presentation from Ormet Circuits, Inc. can be witnessed at two events in November. The first presentation takes place in Anaheim California and is sponsored by CircuiTree Magazine. Please find details at their web site: www.circuitreelive.com The second session will take place in San Jose California at IMAPS. Please visit: http://www.imaps.org/imaps2007/techprogram.htmv. Explanation and descriptions will be offered to install interconnects without drilling through the top and bottom side copper layers. Contact us at Support@ormetcircuits.net for more information on using our materials and patented process to improve your yields.

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For more information about Ormet Circuits, Inc. please visit www.ormetcircuits.com or email support@ormetcircuits.net

Announcement

Date: 2007-11-01 San Diego, CA (Ormet Circuits)

Ormet Circuits, Inc. meets its revenue target for the first half of 2007

Ormet Circuits, Inc. meets its revenue target for the first half of 2007. The customer momentum for new designs and proven process guidelines continue to foster growth for Ormet. OEM design initiatives are challenging the current process methods and allowing Ormet to provide interconnect solutions to save time, space and improve fabricator product yields. The ability to create sub assembly cores, test them and join them together in one final lamination step is becoming very desirable to manufacturing. Ormet`s ability to offer standard materials with standard equipment to the PCB fabricator greatly enhances the OEM customer base for Military, Medical and High-Density commercial products being built on schedule and within budget. Contact us at Support@ormetcircuits.net for more information on using our materials and patented process to improve your yields.

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For more information about Ormet Circuits, Inc. please visit www.ormetcircuits.com or email support@ormetcircuits.net

Announcement

Date: 2007-08-19 San Diego, CA (Ormet Circuits)

Ormet Circuits, Inc and HDI Via Fill find the right combination to fill your plated through-hole nee

Ormet Circuits, Inc and HDI Via Fill find the right combination to fill your plated through-hole needs. Ormet® conductive materials that offer RoHS and Lead free compliance are now available through HDI Via Fill Services. The Ormet materials are installed through HDI`s unique high volume process that will deliver the following features: Planar surface, Tg=0, CTE of 22 as measured from 25

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For more information about Ormet Circuits, Inc. please visit www.ormetcircuits.com or email support@ormetcircuits.net

Announcement

Date: 2007-05-23 San Diego, CA (Ormet Circuits)

Ormet Circuits, Inc works with Rogers Corporation Advanced Materials Division to install its Conduct

Ormet Circuits, Inc works with Rogers Corporation Advanced Materials Division to install its Conductive material in Jade R/Flex product line. The Jade is a Halogen Free adhesive system that has a high Tg, superior thermal and dimensional stability that makes it ideal for mechanically drilling via holes for filling with Ormet 700 and 7000 series family of materials. The combination of materials allows thin product builds, parallel building for high sub assembly yields and lowers cost to manufacturing.

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For more information about Ormet Circuits, Inc. please visit www.ormetcircuits.com or email support@ormetcircuits.net

Announcement

Date: 2007-04-30 San Diego, CA (Ormet Circuits)

Ormet Circuits, Inc works with R&B Design

Ormet Circuits, Inc works with R&B Design to replace its current via in pad designs using Ormet® conductive materials to construct their outer layers. Visit R&B Design at the Del Mar Electronics Fair to understand how this technology lowered cost while lowering RF interference.

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For more information about Ormet Circuits, Inc. please visit www.ormetcircuits.com or email support@ormetcircuits.net

Announcement

Date: 2007-04-06 San Diego, CA (Ormet Circuits)

Ormet Circuits, Inc surpasses its investment goals

Ormet Circuits, Inc presents its conductive adhesive for trial use in customer applications. Several applications are being considered for this material due to its lower curing temperatures (190

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For more information about Ormet Circuits, Inc. please visit www.ormetcircuits.com or email support@ormetcircuits.net

Announcement

Date: 2007-03-16 San Diego, CA (Ormet Circuits)

Ormet Circuits, Inc presents its conductive adhesive for trial use

Ormet Circuits, Inc presents its conductive adhesive for trial use in customer applications. Several applications are being considered for this material due to its lower curing temperatures (190

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For more information about Ormet Circuits, Inc. please visit www.ormetcircuits.com or email support@ormetcircuits.net

Announcement

Date: 2007-02-12 San Diego, CA (Ormet Circuits)

Ormet Circuits, Inc has been contracted by Raytheon to set design rules

Ormet Circuits, Inc has been contracted by Raytheon to set design rules for use of its inks in their next generation RF products. Ormet materials were chosen for their ability to make Z-axis interconnects at any layer or location in the RF design. Limited through-hole plating promotes better RF signal, supports parallel building, offers higher yield and subsequently lowers Raytheon`s cost per panel. Contact us at Support@ormetcircuits.net for building with Ormet® conductive materials.

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For more information about Ormet Circuits, Inc. please visit www.ormetcircuits.com or email support@ormetcircuits.net

Announcement

Date: 0000-00-00 San Diego, CA (Ormet Circuits)

IPC APEX EXPO 2012

Please join Ormet Circuits, Inc. in the upper level Sails Pavilion in booth #711, as they participate in IPC`s APEX EXPO 2012. The IPC Expo is the industry`s only event dedicated to the entire supply chain of electronic interconnections for printed wiring boards, design, manufacturing, assembly and test.

Headquartered in San Diego, CA, Ormet Circuits, Inc. was incorporated in 2003 to manufacture and market conductive pastes and inks for the printed circuit board fabrication and microelectronics industries. Ormet conductive materials find wide use in many electronic applications from radar antennas to semiconductor packages, complex circuit boards, and electronic components and assemblies.

For more information about Ormet Circuits, Inc. please visit www.ormetcircuits.com or email support@ormetcircuits.net.

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For more information about Ormet Circuits, Inc. please visit www.ormetcircuits.com or email support@ormetcircuits.net

Announcement

Date: 0000-00-00 San Diego, CA (Ormet Circuits)

IPC Designer Council April Chapter Meeting Austin, TX

Creating

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For more information about Ormet Circuits, Inc. please visit www.ormetcircuits.com or email support@ormetcircuits.net

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